In this role, you will be working on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As a member of the Packaging Analysis  team, you will perform mechanical design and structural analysis for emerging packaging technologies. You will identify key failure modes under product use conditions and run appropriate parametric design studies to influence product and package design upstream. You will be responsible for the package stack-up analysis, defining mechanical and thermal aspects that influence package form factors, and driving socket/enabling mechanisms. You will utilize Finite Element Analysis (FEA) and Geometric Dimensioning and Tolerancing (GD&T) to propose solutions that finalize the design. Your work will result in advanced package designs that meet power dissipation, assembly, and reliability requirements, while delivering a system level solution for leading edge products in the data centers and high-end compute segment.   

Responsibilities:

• Create mechanical models of package stack-up and associated components.
• Perform mechanical design analysis to identify and implement solutions that improve package mechanical integrity.
• Execute geometric tolerance analysis and create GD&T drawings and CAD models.
• Conduct finite element analysis to highlight key design, assembly, and reliability trade-offs.
• Apply manufacturing expertise to influence design choices, perform FMEAs, and evaluate the cost implications of process and design decisions.
• Collaborate with package and systems teams to ensure packaging solutions comply with system boundary conditions.
• Generate modeling and simulation reports. 

Requirements: 

• BS, MS or  PhD in Mechanical Engineering or a related field.
• Minimum of 5 years of experience in mechanical design and finite element analysis.
• Experience in CAD tools such as Solidworks or AutoCAD, with a focus on mechanical design best practices.
• Expertise in Geometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysis.
• Hands-on experience with FEA solvers such as ABAQUS or ANSYS.
• Working knowledge of semiconductor packaging technologies, including the mechanical and thermal trade-offs of 3D, 2.5D, and FCBGA architectures.

Preferred Qualifications

• Knowledge of ASME Y14.5 standards.
• Excellent communication skills and ability to work well in cross functional teams.
• Ability to drive results independently and with minimal supervision.
• Creative problem-solving skills with a focus on rapid solution implementation.